University of the Punjab.

Overview

Thermal, photophysical, and photochemical processes:
Laser processing, Excitation mechanisms relaxation times, the heat equation, selective excitations of molecules,
Models of Pulsed Laser Ablation, Photo-thermal Ablation: Photo-physical Ablation, Photo-chemical Ablation, Three Regimes of Laser Ablation,
Primary Mechanisms of Pulsed Laser Sputtering: Collisional Sputtering, Thermal Sputtering, Electronics
Sputtering, Hydrodynamical Sputtering
Experimental aspects of laser processing: Lasers, Experimental aspects, spatial confinement, CW lasers, Gaussian beams, pulsed and high power CW lasers, micro processing, reaction chamber, confinement of the excitation, the thermal field, gas-liquid and adsorbed phase excitations, plasma formation, material damages. Surface melting, Vaporization,
Plasma formation: Temperature distributions, interface velocities, boundary conditions, temperature dependence of parameters, solidification, process optimization, convection, surface deformation, welding, liquid phase expulsion. Plasma formation, ionization, optical properties of plasmas, laser –supported absorption waves (LSAW), laser supported combustion waves (LSCW), laser supported detonation waves (LSDW), superdetonation, Laser processing techniques.
Nanosecond and Ultrashort Pulse Laser Ablation: Surface patterning, ablation mechanisms, models, interaction below threshold, the threshold fluence, ablations rates, photothermal volume decomposition, dissociation of polymer chains, defect-related processes, thermo-and photomechanical ablation, biological tissues, material damage, debris, strong absorption, finite absorption, debris. Material patterning and damage, long pulses and short pulses, time resolved dynamics, molecular dynamics simulations, the two-temperature model, damage thresholds, ablation rates, avalanche- and multiphoton ionization, high-aspect-ratio holes, fabrication of cavities in bulk materials, ablation at overcritical temperatures, comparison of nanosecond and ultrashort-pulse laser ablation.
Applications of Laser Matter Interaction:
Processing Systems, Mechanism of Laser Cutting, Forms of Laser Cutting, Fusion Cutting, Sublimation Cutting, Photochemical Ablation, Laser Welding, Laser Drilling, Laser Process Parameters, Effect of Beam Characteristics, Plasma Formation, Gas Shielding, Focal Point Location, beam Absorption, Initial Workpiece Microstructure, Advantage and Disadvantages of Laser Material Processing.
Etching of metals, insulators, and semiconductors:
Structural transformation, laser cleaning, Doping, Cladding, alloying and synthesis, Oxidation, nitradation, reduction, Transformation and decomposition of organic, materials.
Theories and Understanding of physical Mechanisms of laser: Laser-included Nano scale Periodic Surface Structures (Nano ripples), Nano-Bumps, Nano-cones, Nano-Pores, Nano-Craters, Nanoparticles
PULSED Laser Deposition Technique, Effects of Processing Parameter, Laser fluence, Laser wavelength, Ambient gas Pressure, Target-to-substrate Distance, and Temperature of the substance.
Identification of ultrafast electronic and slow thermal process by Time of Flight Mass Spectrometry and Surface Topography Investigation.